Black silicon carbide micro powder product details：Black silicon carbide micro powder is black in appearance, fragile and sharp in nature, featured by good thermal and electrical conductivity.

It is the hexagonal crystal in microscopic shape. 9.2 in Moh's hardness of silicon carbide, 3000-3300 kg/was in Vickers microhardness, 2670--2815kg/mm in Knoop hardness, 3300kg/mm3 in microhardness, higher than corundum in abrasive, second to diamond, cubic boron nitride and boron carbide, generally acknowledged as 3.20～3.25 in density, between 1.2-1.6 g/mm3 in natural bulk density of silicon carbide abrasive, 3.20～3.25 in specific gravity. The black silicon carbide uses petroleum coke and high quality silica as the main raw materials. Compared with green silicon carbide, it is lower in purity, hardness and fragility.

Main uses: cutting and grinding of silicon wafer, semiconductor silicon wafer, quartz chip, manufacturing of bonded and coated abrasives, grinding and polishing of stone materials,  Senior refractory materials, steelmaking furnace charge, etc.

Green silicon carbide micro powder product details：Green silicon carbide micro powder is green in appearance, crystal structured, features high hardness, strong cutting force, steady chemical property, and good thermal conductivity.

It is the hexagonal crystals in microscopic shape, 9.2 in Moh's hardness of silicon carbide, 3000-3300 kg/ mm2 in Vickers microhardness, 2670--2815kg/mm in Knoop hardness, 3300kg/mm3 in microhardness, higher than corundum in abrasive, second to diamond, cubic boron nitride and boron carbide, generally acknowledged as 3.20g/mm3 in density, between 1.2-1.6 g/mm3 in natural bulk density of Silicon carbide abrasive, 3.20～3.25 in specific gravity. The green silicon carbide uses petroleum coke and high quality silica as the main raw materials, salt as additives, melted at high temperature in the resistance furnace, between corundum and diamond in hardness, higher than corundum in mechanical strength.

Main uses: cutting and grinding of silicon wafer, semiconductor silicon wafer, quartz chip, polishing of crystal and ferrite, precision finishing of ceramics and special steel, cutting and free grinding and polishing of bonded and coated abrasives, grinding of glass, stone materials, agate and senior jewelry and jade article etc. nonmetal materials, manufacturing of super refractory materials, engin